When your winter jacket slows heat escaping your body or the cardboard sleeve on your coffee keeps heat from reaching your ...

A new study investigated the source of a leak in a ‘miracle measurement’ from 2010 – and engineers found a potential solution ...

Abstract: In this work, a 300 mm wafer with Cu pads of 1 μm x 1 μm is used for a hybrid bonding process research. The Cu/SiO 2 layers were planarized by a three-platen CMP process using different ...

Abstract: This study focuses on the fabrication and thermomechanical characteristics of cobalt-filled through silicon Vias (Co-TSVs) with diameters ranging from 3 to 5 μm, Optimization of the ...