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Advanced packaging is transforming semiconductor manufacturing into a multi-dimensional challenge, blending 2D front-end wafer fabrication with 2.5D/3D assemblies, high-frequency device ...

In Part 1 we discussed how engineers improve processes, and how new technology can fall short of manual operations. The importance of dynamic, flexible solutions was stressed as the only way process ...

Vivet Technology's Repeating Layer Process (RLP) replaces traditional sequential assembly lines with simultaneous production steps, eliminating bottlenecks and enabling manufacturers to scale capacity ...

The green hydrogen revolution, central to renewable energy development and decarbonization, is increasingly scrutinized through two critical lenses: cost and carbon intensity. Hydrogen production ...

The recently announced framework significantly reduces CFD simulation runtimes from hours to less than 5 min. using GPU acceleration and cloud resources. OpenUSD enables seamless data exchange and ...