(Nanowerk News) University of Wisconsin-Madison engineers have found a way to simultaneously mitigate three types of defects in parts produced using a prominent additive manufacturing technique called ...

A newly drafted IEEE standard will bring more consistency to defect metrics in analog/mixed (AMS) designs, a long-overdue step that has become too difficult to ignore in the costly heterogeneous ...

Advancements in nanotechnology fabrication and characterization tools have facilitated a number of developments in the creation of new two-dimensional (2D) materials and gaining and understanding of ...

Silicon computer chips have served us well for more than half a century. The tiniest features on chips currently sold are approximately 3 nanometers — a startlingly small size given that a human hair ...

Reducing defects on the wafer edge, bevel, and backside is becoming essential as the complexity of developing leading-edge chips continue to increase, and where a single flaw can have costly ...

(Nanowerk Spotlight) Scientists have sought to leverage atomic defects to enhance electrocatalytic performance for clean energy applications. However, the inability to precisely study defects' ...

New research offers an enhanced understanding of common defects in transition-metal dichalcogenides (TMDs) -- a potential replacement for silicon in computer chips -- and lays the foundation for ...

This paper reviews the research progress of layered double hydroxide (LDH) with various types of defects and its regulation strategies in recent years. Furthermore, the relationship between the ...