背景介绍近年来，随着半导体工艺演进，工艺节点不断缩小，电路复杂度持续上升，频率越来越高，传统的Scan测试方法已经难以满足对速率、覆盖率、功耗和测试时间等多个维度的要求。因此，一种新兴的高速Scan测试方案应运而生.

Zeiss has announced the launch of its Laser Scanning Module 'Zeiss LSM DuoScan', designed to radically expand the frontiers in live cell imaging. The module adds a second laser scanner to the LSM 510 ...

JTAG Technologies (Eindhoven, the Netherlands) has introduced the DIMM 2128 family of digital I/O scan modules that increase test coverage on complex PCBs. The scan modules increase test coverage via ...

GRENOBLE, France, Sept. 08, 2020 (GLOBE NEWSWIRE) -- Teledyne e2v, a Teledyne Technologies [NYSE: TDY] company and global innovator of imaging solutions, announces that it has expanded its product ...

Boundary scan test system firm Goepel Electronic has introduced Module/DIMM244so as an I/O module of the CION product family. The module is serially controlled via TAP by special CION Asic chips, and ...

Goepel electronic has expanded its ScanFlex boundary-scanhardware platform with a digital I/O module that provides independentlyprogrammable I/O channels and is able to process voltages of up to 30 V.

The 3D laser scanning module that may make an appearance on the "iPhone 8" raises a number of questions, and a new report attempts to shed some light on the subject, including what model of iPhone it ...