The project is structured around distinct work plans, developed around technical work packages specifically tailored to the strengths of each consortium member illustrating both the comprehensiveness ...

Hill Helicopters engineered composite main rotor blades using a novel single-cure manufacturing process for stiffness and ...

System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing ...

Many of today's embedded systems are providing more sophisticated solutions to a wide variety of applications and industries. With this increase in sophistication, there is a corresponding increase in ...

Today’s fan-out wafer-level packaging (FOWLP) processes use organic substrates composed of epoxy mold compound (EMC) created using a thermal compression process. EMC wafers are a cost-effective way to ...